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Glance Foundry
Services
Overview
Design & Mask
Layout review, photomasks, e-beam writing
Substrate & Wafers
Si, SOI, glass, quartz, sapphire, SiC, GaN
Photolithography
Mask aligner, maskless aligner, e-beam lithography
Thin Film Deposition
E-beam, thermal, sputter, PECVD, APCVD, ALD, parylene
Etching
Plasma etcher/asher, RIE, ICP-RIE, wet etching
Lift-Off Patterning
Undercut resist stacks, metal lift-off
Electroplating
Cu, Ni, Au, Sn
Annealing
Tube furnace, oxidation, RTA
Dicing & Packaging
Blade dicing, die handling, wire bonding
Cooling
Solutions
Liquid cooling overview
Why AI hardware went liquid
Solder TIM metallization
The solder interface, by evaporation or sputter
Si microchannel cooling
Channels etched and bonded to the die
GF
Membership
Membership Overview
A closer connection to the foundry
GF Process Studio
From fabrication steps to a process plan
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Membership and access
Process
Studio
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